Ceramic Insulating Heat Dissipation Substrates
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Ceramic insulating heat dissipation substrates
Ceramic insulating heat dissipation substrates are a specialized type of ceramic substrate used in electronic devices and other applications that require effective heat dissipation. These substrates are typically made of materials such as aluminum nitride, silicon carbide, or alumina, which are known for their ability to withstand high temperatures and high thermal conductivity.
The primary function of ceramic insulating heat dissipation substrates is to dissipate heat generated by electronic components such as power semiconductors and light-emitting diodes (LEDs). The substrates are designed to provide excellent thermal conductivity, enabling efficient heat transfer from the electronic components to the surrounding air or cooling system. The ceramics used in these substrates are highly insulating, which means they provide exceptional electrical insulation properties, protecting the electronic components from damage due to electrical overload or short circuits.
Ceramic insulating heat dissipation substrates are popular in various industrial applications, including automotive electronics, power electronics, aerospace, and LED lighting. They are preferred over other materials, such as plastics or metals, for their superior thermal conductivity, electrical insulation, and durability. The high thermal conductivity of these substrates also ensures that there is less thermal stress on both the electronic components and the substrate material, which improves reliability and performance.
Overall, ceramic insulating heat dissipation substrates offer excellent performance and reliability in electronic applications that require effective heat dissipation, high thermal conductivity, and electrical insulation.
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Item:Ceramic Insulating Heat Dissipation Substrates
Material:Si3N4
Color:Gray
Thickness:0.25-1mm
Surface processing:Double polished
Bulk density: 3.24g/㎤
Surface roughness Ra: 0.4μm
Bending strength: (3-point method):600-1000Mpa
Modulus of elasticity:310Gpa
Fracture toughness(IF method):6.5 MPa･√m
Thermal conductivity: 25°C 15-85 W/(m･K)
Dielectric loss factor:0.4
Volume resistivity: 25°C >1014 Ω･㎝
Breakdown strength:DC >15㎸/㎜