Ceramic Substrates

As the professional manufacturer, we would like to provide you Ceramic substrates. Ceramic substrates are flat, rigid, and often thin plates or boards made from ceramic materials, primarily used as a base or support for electronic components and circuits. These substrates are essential in various applications, including electronics, semiconductors, and other fields where heat resistance, electrical insulation, and mechanical stability are required. Ceramic substrates come in different shapes, sizes, and compositions to suit specific applications. They provide a stable and thermally conductive foundation for mounting and interconnecting electronic components, making them crucial for the performance and reliability of electronic devices and systems.

The Torbo® Ceramic substrates

Item:Silicon nitride substrate

Material:Si3N4
Color:Gray
Thickness:0.25-1mm
Surface processing:Double polished
Bulk density: 3.24g/㎤
Surface roughness Ra: 0.4μm
Bending strength: (3-point method):600-1000Mpa
Modulus of elasticity:310Gpa
Fracture toughness(IF method):6.5 MPa･√m
Thermal conductivity: 25°C 15-85 W/(m･K)
Dielectric loss factor:0.4
Volume resistivity: 25°C >1014 Ω･㎝

Breakdown strength:DC >15㎸/㎜

Torbo® ceramic substrates manufactured in Chinese factories are widely used in electronic fields, such as power semiconductor modules, inverters and converters, replacing other insulating materials to increase production output and reduce size and weight. Their extremely high strength also makes them a key material for increasing the longevity and reliability of the products they use.

Double-sided heat dissipation in power cards (power semiconductors) , power control units for automobiles