Ceramic substrates are currently used in power electronic modules, advantages: high mechanical strength, toughness and thermal conductivity
The silicon nitride has a higher cost higher than the aluminum nitride substrate, and the thermal conductivity is over 80 or more. Silicon is mainly applied to the power electronic module, such as IGBT modules, and car standard blocks, as well as military, aerospace modules.
The ceramic substrate is mainly used for high mechanical strength and toughness. At present, because this power module is too large, the required copper thickness is relatively high (at least 500um or more). From now we have done, the silicon nitride follow-up application requires that the copper thickness is also low (some IGBT modules that require high current)