First, the nature of the ceramic substrate
1. Mechanical properties: (formation of circuit wiring)
a. Have a high high mechanical strength, in addition to carrying components, can also be used as support components;
b. Processability, high dimensional accuracy, easy to achieve multi-layered;
c. Smooth surface, no warpage, bending, microcracking, etc.
2, electrical performance:
a. Insulation resistance and insulation - resistant voltage height;
b. The dielectric constant is low, the dielectric loss is small.
c. Performance is stable under conditions of high temperature and high humidity, ensuring reliability;
3, thermal properties:
a high thermal conductivity;
b. The coefficient of thermal expansion is matched with the related material (especially the coefficient of thermal expansion of Si);
c. Excellent heat resistance.
4, other properties:
a. Good chemical stability, easy metallization, strong circuit graphics and strong attachment;
b. No moisture absorption, oil resistance, chemical drug, small A ray release;
c. The substance used is no pollution, non-toxic, the crystal structure is not changed in the temperature range; D. The raw material resources are rich, the technology is mature, the manufacturing is easy, and the price is low.