Power electronic substrate
Product Description
Product Detail
Power electronic substrate
Power electronic substrates are a type of material used in the construction of power electronic components such as power modules, inverters, and converters. They are typically made of ceramics or other high-temperature material that provides a robust, high thermal conductivity, and reliable electrical insulation. These substrates are designed to provide the necessary support and thermal management for power electronic components, allowing them to operate efficiently and reliably.
Power electronic substrates are used in various applications, such as motor drives, renewable energy systems, electric vehicles, and other power electronics applications. They are specially designed to handle high-power applications where thermal management is crucial for efficient operation. For example, high-temperature ceramics such as aluminum nitride (AlN) or silicon carbide can conduct heat up to 10 times better than metals such as copper, which makes them excellent materials for power electronic substrate applications.
In addition to their high-temperature and thermal conductivity properties, power electronic substrates offer excellent electrical insulation, which is essential in power electronics. Electrical insulating materials prevent short circuits and protect against damage from high voltages, ensuring that power electronic components are safe and reliable.
Overall, power electronic substrates are essential materials for the construction of power electronic components. Their high-temperature and thermal conductivity properties, combined with excellent electrical insulation, make them an ideal choice for power electronics applications that require high reliability and efficient thermal management.
You are welcomed to come to our factory to buy the latest selling, low price, and high-quality Power electronic substrate. Torbo look forward to cooperating with you.
The Torbo® Power electronic substrate
Item:Power electronic substrate
Material:Si3N4
Color:Gray
Thickness:0.25-1mm
Surface processing:Double polished
Bulk density: 3.24g/㎤
Surface roughness Ra: 0.4μm
Bending strength: (3-point method):600-1000Mpa
Modulus of elasticity:310Gpa
Fracture toughness(IF method):6.5 MPa･√m
Thermal conductivity: 25°C 15-85 W/(m･K)
Dielectric loss factor:0.4
Volume resistivity: 25°C >1014 Ω･㎝
Breakdown strength:DC >15㎸/㎜